**THIS JOB CAN BE LOCATED IN FORT COLLINS, CO OR SAN JOSE, CA**
Job Description:
As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements. 2.5D & 3D is cutting edge package technology with needs pushing the technology limits.
Job Scope (Advanced Package Technology Engineer) :
Basic:
---Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in:
--- or PhD with 10+ years' of relevant experience
Specific :
---4 to 6 years' Hands-On experience in 2.5D / 3D Development;
---In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.
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